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Leidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in D
Job Source: LeidosLeidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a part-time Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a stron
Job Source: LeidosLeidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong backgro
Job Source: LeidosFusion408
Carlsbad, CA, United States
Principal ASIC Design Engineer Description: Expertise in at least 3 of the following: communication system design, RF radio design, digital ASIC design, applications platforms, and semiconductor device modeling. Requirements: Principal Engineer will be responsible for design and development from multiple ASIC blocks to a complete Core/Chip in c
Job Source: Fusion408InnoPhase IoT
San Diego, CA, United States
About InnoPhase IoT If you are keen to work with a bunch of brilliant people with various backgrounds, if you share the same value of working smart and celebrating successes, if you have enthusiasm for big technology in a small company, if your goals are to learn and experience different aspects of worknot just singing the same song every day, you
Job Source: InnoPhase IoTQualcomm
San Diego, CA, United States
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > ASICS Engineering General Summary: Qualcomm is the world leader in wireless ICs powering the majority of 4G and 5G devices and the largest fabless semiconductor company in the world. Qualcomm is looking for bright ASIC engineers with excellent analytical and techn
Job Source: QualcommApple Inc.
San Diego, CA, United States
Are you a leader? Do you want to utilize your engineering background to make big things happen? Can you influence, connect, get results and communicate effectively? Can you deliver on a predictable and dynamic schedule? We have an extraordinary opportunity for senior level engineers to drive and lead technical engagements between Apple and silicon
Job Source: Apple Inc.Qualcomm
San Diego
**Company:** Qualcomm Technologies, Inc. **Job Area:** Engineering Group, Engineering Group > ASICS Engineering **General Summary:** As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives communication and data processing transformation to help create a smarter, connecte
Job Source: QualcommSan Diego, CA, United States
Description
The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.
Primary Responsibilities:
The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base’s (DIB) access to trusted, state-of-the-art microelectronics.
This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country..
Provide occasional technical support and/or field support planning, and other field support in general if needed.
Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.
Interact with outside customers, suppliers, and functional peer groups.
Some travel and work at remote sites for limited time periods may be occasionally required.
Provide status reports to project managers and/or division production manager as required.
Basic Qualifications:
U.S. Citizenship with the ability to obtain a TS clearance.
BS and 8 years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 6+ years of experience
Experience with DSP fundamentals and FPGA implementation
Experience with Matlab/Simulink
Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.)
Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:
Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)
Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)
Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)
Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)
Preferred Qualifications:
8+ years experience in leading a design team
Experience in hardware test and measurement and hands-on lab debug
Experience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRx
LInC
Electronic Warfare
Original Posting Date: 2024-04-29 While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range: Pay Range $101,400.00 - $183,300.00
The Leidos pay range for this job level is a general guideline only and not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.
Email Alert for Microelectronics ASIC Design Engineer jobs in San Diego, CA, United States
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