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Leidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong backgro
Job Source: LeidosLeidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in D
Job Source: LeidosLeidos Holding
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in D
Job Source: Leidos HoldingLeidos
San Diego, CA, United States
Description The EW Division of Leidos is looking for a Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in
Job Source: LeidosKyocera International
San Diego, CA, United States
Description We are seeking a highly skilled and experienced Senior RFIC (mmWave) Design Engineer to join our dynamic team. The successful candidate will play a pivotal role in the design and development of high-performance RFIC transceiver for our state-of-the-art mmWave solution. As a Senior RFIC Design Engineer, you will oversee the design, im
Job Source: Kyocera InternationalApple, Inc.
San Diego, CA, United States
Summary Posted: Feb 12, 2024 Role Number: 200513241 Would you like to join Apple's growing wireless silicon development team? The wireless RFIC team architects, designs, and validates radio transceivers integrated into complex wireless SoCs. Our wireless organization is responsible for all aspects of wireless silicon development that transform t
Job Source: Apple, Inc.Kyocera
San Diego, CA, United States
We are seeking a highly skilled and experienced Senior RFIC (mmWave) Design Engineer to join our dynamic team. The successful candidate will play a pivotal role in the design and development of high-performance RFIC transceiver for our state-of-the-art mmWave solution. As a Senior RFIC Design Engineer, you will oversee the design, implementation,
Job Source: KyoceraInnoPhase IoT
San Diego, CA, United States
About InnoPhase IoT If you are keen to work with a bunch of brilliant people with various backgrounds, if you share the same value of working smart and celebrating successes, if you have enthusiasm for big technology in a small company, if your goals are to learn and experience different aspects of worknot just singing the same song every day, you
Job Source: InnoPhase IoTSan Diego, CA, United States
Description
The EW Division of Leidos is looking for a part-time Senior Microelectronics Design Engineer to work with a multi-disciplined design team (electrical engineers, systems engineers, scientists, etc) to design, develop, simulate, and integrate innovative custom microelectronics in support of warfighter missions. Candidate will have a strong background in Digital Signal Processing (DSP) algorithms and their implementation in MATLAB and FPGAs in support of a fast paced, multi-disciplinary design team. This role will also support integration, test, and verification in the final products.
Primary Responsibilities:
• The successful candidate will support technical and programmatic assessments of technologies, capabilities, materials, equipment, and performers in support of the advancement of the U.S. Defense Industrial Base’s (DIB) access to trusted, state-of-the-art microelectronics.
• Lead or support marketing and business development initiatives: develop technical solutions and new ideas for response to capture efforts (e.g., BAAs, RFPs etc.)
• Lead a microelectonics design team to design, integrate and test challenging DSP FPGA designs for EW sensor systems.
• This position will interface and collaborate with a range of engineers, scientists, policy makers, and executives within the government, industry and academia across the country..
• Provide occasional technical support and/or field support planning, and other field support in general if needed.
• Conduct experimental tests on latest SoC evaluation boards, evaluate results, and then develop specifications for selecting next-generation components for deliverable systems.
• Interact with outside customers, suppliers, and functional peer groups.
• Some travel and work at remote sites for limited time periods may be occasionally required.
• Communicate results in briefings and written material to your team, the Customer and management
Basic Qualifications:
• U.S. Citizenship with a Secret-level clearance with the U.S. government. Ability to obtain a TS clearance.
• BS and 17+ years required. Masters Degree in Electrical Engineering, Computer Engineering, Computer Science or related technical discipline desired with 15+ years of experience
• Experience with DSP fundamentals and FPGA implementation
• Experience with Matlab/Simulink
• Experience with microchip EDA tools and flows (Synopsys, Cadence, etc.)
• Microelectronics hardware subject matter expertise in at least (1) of the areas listed below AND experience in (1) additional area listed below:
• Microelectronics Supply Chain: microelectronics hardware verification/security/trust/assurance, vendor selection/qualification/audit, procurement (i.e. domestic foundry interaction)
• Wafer-Level Design: digital, RF and/or mixed signal circuit design (schematic, layout), modeling & simulation of key circuit parameters (power, speed, timing, signal integrity, thermal, reliability, etc.)
• Chip-Scale Design: digital, RF and/or mixed signal device packaging design/layout (2D-3D, chiplet/UCIe), substrate/interposer design (HDI, HDBU, EMIB), chip attach (epoxy, solder), chip interconnect (chiplet, flipchip, wire/ribbon bonding), modeling & simulation (power, speed, timing, signal integrity, thermal, structural, reliability)
• Hardware Programming: FPGA (i.e. Verilog, VHDL), Programming (Linux command line/scripting, Python, Java, and C++)
Preferred Qualifications:
• 8+ years experience in leading a design team
• Experience in hardware test and measurement and hands-on lab debug
• Experience with interfaces: ADC/DACs, SerDes, PCIe, JTAG, DDRx
LInC
Electronic Warfare
Original Posting Date: 2024-05-16 While subject to change based on business needs, Leidos reasonably anticipates that this job requisition will remain open for at least 3 days with an anticipated close date of no earlier than 3 days after the original posting date as listed above.
Pay Range: Pay Range $144,300.00 - $260,850.00 The Leidos pay range for this job level is a general guideline onlyand not a guarantee of compensation or salary. Additional factors considered in extending an offer include (but are not limited to) responsibilities of the job, education, experience, knowledge, skills, and abilities, as well as internal equity, alignment with market data, applicable bargaining agreement (if any), or other law.
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Email Alert for Senior Microelectronics Design Engineer jobs in San Diego, CA, United States
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