Principal Engineer Packaging Engineering

Milpitas, CA, United States

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES

As a Packaging Engineer, you will work in the Packaging R&D group on the modeling and simulation, design of experiment and testing across semiconductor packaging, flash memory product and host levels.

Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability (under harsh use conditions).

Responsible for the modeling and simulation, design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives.

This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.

Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.

Qualifications:

Qualifications

REQUIRED

Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.

Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.

Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.

Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).

Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.

Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.

SKILLS

Strong oral and written communication skills.

Demonstrated strong work ethic.

Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.

Additional Information

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the Equal Employment Opportunity is the Law poster.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

#LI-AS1

Qualifications

REQUIRED

* Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.

* Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.

* Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.

* Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).

* Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.

* Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.

SKILLS

* Strong oral and written communication skills.

* Demonstrated strong work ethic.

* Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.

Additional Information

Western Digital is committed to providing equal opportunities to all applicants and employees and will not discriminate based on their race, color, ancestry, religion (including religious dress and grooming standards), sex (including pregnancy, childbirth or related medical conditions, breastfeeding or related medical conditions), gender (including a person’s gender identity, gender expression, and gender-related appearance and behavior, whether or not stereotypically associated with the person’s assigned sex at birth), age, national origin, sexual orientation, medical condition, marital status (including domestic partnership status), physical disability, mental disability, medical condition, genetic information, protected medical and family care leave, Civil Air Patrol status, military and veteran status, or other legally protected characteristics. We also prohibit harassment of any individual on any of the characteristics listed above. Our non-discrimination policy applies to all aspects of employment. We comply with the laws and regulations set forth in the [Equal Employment Opportunity is the Law](https://www.dol.gov/sites/dolgov/files/ofccp/regs/compliance/posters/pdf/eeopost.pdf) poster.

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [[email protected]](mailto:[email protected]) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

\#LI-AS1

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