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Austin / Global
Develop optimized electrical package designs for new products and technologies, meeting performance, manufacturability, and cost requirements. Perform and document electromagnetic modeling, collaborate with SoC, PCB, and layout teams to improve package and I/O performance, and provide electrical models for system-level simulation.
Requirements: A master's degree in electrical engineering or a related field, plus experience in microelectronics packaging design and electromagnetic modeling, is required. Preferred qualifications include proficiency with electromagnetic simulation tools, RF and antenna modeling, knowledge of semiconductor I/O interfaces and PCB design, and strong communication and teamwork skills.
Key Skills: IC Package Design, Electromagnetic Modeling, Electromagnetic Simulation, RF Design, RF and Multi-Gigahertz Modeling, Antenna Modeling, Signal Integrity, Power Integrity, I/O Interface Design, PCB Design, Package Layout Optimization, System-Level Simulation, Electrical Performance Optimization, Communication and Presentation, Cross-Functional Collaboration
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