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VP, Power Products (28301)

Tempe, AZ, United States

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com.

Position Summary:

Amkor is currently seeking a VP, Power Products for our Tempe, AZ office. The primary function of this position is program management for development of packaging for the Wirebond and Power business unit focusing on analog, microcontroller and the power electronics market segments. This person will be a primary interface with Tier 1 customers and Amkor's leading edge R&D center in South Korea.

Essential Duties and Responsibilities:

* Drive and coordinate development activities with customers and Amkor's development teams

* Lead Tier 1 customer meetings, discussions and follow-ups during project development for wire-bonded packages, leadframe packages and power packages

* Coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirements

* Manage and lead cross-functional teams comprised of design center and characterization resources to optimize novel designs and to establish design rules for new IC package families

* Manage product management through initial production ramp

Required Qualifications:

* This position requires a Bachelor's degree in Engineering (Mechanical, Chemical, or Materials Science)

* 15+ years of experience in semiconductor packaging development is required, a minimum of 13+ years with a PhD

* The qualified candidate will be able to work independently in a global organization with demonstrated experience in IC package process development

* The qualified candidate understand the IC package design environment, and tradeoffs associated with package design during package process development

* Direct previous product management experience involving off-shore process development is highly desired

* Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required

* Demonstrated, effective leadership skills and capabilities

* Excellent written and verbal communication, presentation skills required

* This position requires 20% domestic and 20% international travel

Preferred Qualifications:

* Working knowledge of IC IO drivers and associated electrical interactions and trade-offs with different IC packaging technologies

* Knowledge of thermal or mechanical simulations and modeling is desired

* Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus

* Customer product roadmap translation to IC packaging development roadmap

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

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