Micron

Boise / Global

Intern: Next-Gen DRAM Process Integration Engineer

$55.000 - $85.000

Job Summary

Salary Range:: $55.000 - $85.000

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Job Description

Micron Technology in Boise invites a PhD candidate in Materials Science and Electrical Engineering to join the 3D DRAM organization. You will work on integration and device-level challenges, focusing on performance and manufacturability in a cutting‑edge 300mm R&D facility.

The role emphasizes cross‑functional collaboration and hands‑on experimentation. Ideal candidates will have strong data analysis skills, a passion for semiconductor innovation, and a drive to advance memory technology while

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Micron

Intern: Next-Gen DRAM Process Integration Engineer

Job Summary

Job Description

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Micron

Intern: Next-Gen DRAM Process Integration Engineer

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Similar Opportunities

Micron Technology, Inc

DRAM Process Integration Intern — Next-Gen Memory

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