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Intel

Phoenix / Global

Packaging Engineer: Media, Collaterals & Processes (Onsite)

  • $85.000 - $120.000

Job Summary

Salary Range:
$85.000 - $120.000
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Job Description

Intel seeks an experienced engineer in Phoenix to develop assembly processes and equipment for next‑generation packaging. You will optimize package manufacturing to meet quality, reliability, cost, yield, and productivity targets, and define specifications using DOE and SPC methods.

The role requires strong CAD skills in SolidWorks and AutoCAD, plus a portfolio of projects from concept to fabrication. On-site work in Phoenix is expected.

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