Process Engineer (Metallization)

About Syenta

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.

Founded in Australia, our growing footprint in the US represents a key milestone in our journey. We are building a world‑class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About the Role

We are seeking a Process Engineer (Metallization) to support the development and optimization of Syenta’s core LEM metallization processes. This is a hands‑on, high‑impact role working at the heart of our technology — bridging experimental R&D, process engineering, and early‑stage manufacturing.

You will take ownership of designing and executing experiments, improving process performance, and translating learnings into robust, repeatable workflows. Working closely with cross‑functional teams, you will play a key role in advancing our prototype systems toward scalable production.

Responsibilities

Electroplating Process Ownership

Support the development and performance of electroplating processes within Syenta’s LEM platform

Develop and refine electrolyte chemistries, including optimization of additive systems (suppressors, accelerators, levellers, inhibitors)

Define electrochemical deposition windows that balance performance, repeatability, and manufacturability

Drive improvements in film properties including adhesion, stress, microstructure, uniformity, and defectivity

Process Development & Optimization

Design and execute structured experiments (DOE, parameter sweeps) across tightly coupled chemical and process variables

Optimise deposition conditions (e.g. current density, waveform, transport effects) to improve yield and consistency

Establish process control strategies, acceptance criteria, and repeatability standards

Translate experimental results into actionable process improvements

Defect Analysis & Process Improvement

Investigate plating defects such as voids, seams, roughness, non‑uniformity, stress cracking, and adhesion failures

Correlate defects to chemistry, interfaces, transport, waveform, and tool behavior

Implement corrective actions to improve process robustness and reduce variability

Build mechanistic understanding to support long‑term stability and scalability

Scale‑Up & Manufacturing Integration

Translate lab‑scale processes into stable, repeatable manufacturing workflows

Support process transfer to pilot lines and external fabrication partners

Identify and mitigate risks related to yield, cost, and scalability

Contribute to process standardization and documentation for manufacturing readiness

Technical Leadership & Cross‑Functional Collaboration

Act as a subject matter expert in electroplating and electrochemistry within the organization

Work closely with materials, hardware, and product teams to integrate metallization processes into the broader system

Requirements

B.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering

5+ years of hands‑on experience in electroplating or electrochemical process development

Strong experience with copper electroplating or similar metal deposition systems

Background in semiconductor manufacturing, advanced packaging, or related high‑precision industries

Proven ability to solve complex process and defect‑related challenges

Strong experimental design (DOE), data analysis, and problem‑solving capabilities

Experience working in laboratory and/or cleanroom environments

Preferred Qualifications

Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments

Experience scaling processes from R&D through to manufacturing

Familiarity with metrology and characterization tools (SEM, profilometry, electrical testing)

Experience working with prototype or custom‑built hardware systems

Exposure to adjacent industries (PCB, MEMS, surface finishing) with relevance to high‑resolution systems

Why Choose Syenta?

We’re passionate about building a diverse, people‑first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.

What We Offer

Salary Range: US $100k – $130k (negotiable)

Early‑stage equity opportunities

Potential 401(k) and other benefits

Comprehensive health, dental, and vision coverage plans, supported by Company

Professional Growth – We’re scaling fast, so responsibilities can expand significantly in tandem with the business

Team Events – Annual company event in Australia to collaborate and celebrate

Work‑Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life

15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.

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