Job TitleSolid knowledge of semiconductor device/circuit/module/system reliability, RF circuit design and testing, failure modes, related to compound semiconductor technologies (GaAs, GaN and SiGe, etc.)Familiar with industry standards and procedures, including JEDEC, MIL-STD, Telcordia, IPC, ECSS.Proven experience with environmental stress testing methods and equipment, including Thermal vacuum (TVAC), Shock, Vibration, Constant Acceleration, Temperature Cycle, Radiation testing, EMI/EMC.Experience with Burn-in, Accelerated Life Test, HTOL, and their related PCB design, test fixture design and setup, and PCB/PCBA fault finding.Knowledge of FMEA, FMECA and failure rate prediction methodologies with hands-on experience using industry-standard approaches (MIL-STD-1629A, IEC 60812, and MIL-HDBK-217) with the ability to apply statistical models and reliability prediction tools to assess component & system-level reliability performance.Experience with Destructive Physical Analysis (DPA) and Failure Analysis methods and tools such as X-Ray, CSAM, cross-section, IR imaging, EDS, De-lidding, die shear, lap shear, bond pull tests.Able to analyze and present data using tools (e.g. MS Excel, JMP, Minitab). Experience with ADS, Altium Designer, Windchill, Python, R, LabVIEW, Visual Basic is a plus.Experience with RF test equipment, such as spectrum analyzers, network analyzers, and power meters.Due to ITAR restrictions must be US permanent resident or US citizen.
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