Director, IC Packaging Engineering - Mechanical Simulation

General Summary This position is part of Qualcomm's Integrated Circuits (IC) Packaging organization and represents a senior leadership role within the Mechanical Simulation function. The Director will lead a team of engineers responsible for delivering FEA-based mechanical simulation solutions in support of Qualcomm's current and next-generation chipsets and advanced packaging technologies.

Core Technical Responsibilities The Director will drive strategic alignment across IC package design/architecture, New Product Introduction (NPI), assembly, and Chip-Package Interaction (CPI) teams, ensuring high-quality mechanical simulation support across High Volume Manufacturing (HVM) and advanced packaging programs. Key responsibilities include:

Overseeing the development and validation of mechanical FEA models (ANSYS APDL).

Establishing BKM methodology for test correlation and material characterization.

Guiding stress/mechanical analysis for IC package designs, including warpage, solder joint reliability (SJR), package assembly process simulation, board level reliability (BLR), and chip-package-board interaction.

Championing innovation in simulation workflows, automation, and tooling to improve team efficiency and scalability.

Leading strategic initiatives to advance simulation methodology and best practices across cross-functional teams.

Minimum Qualifications Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications Ph.D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or related field.

12+ years of combined experience in finite element modeling and analysis for IC electronic packaging and interconnects.

5+ years of direct people management, with experience managing managers or senior technical staff.

Proven track record of building and scaling high-performing simulation or engineering teams.

Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, package-board interaction, and DOE.

Strong background in electronic packaging materials and thermo-mechanical behavior.

Experience establishing simulation BKMs, methodologies, and automation frameworks (e.g., APDL macros, OptiSLang, scripting/automation pipelines).

Experience with material testing for strength and fracture, including designing and executing mechanical test methods.

Demonstrated experience presenting technical roadmaps and simulation strategies to executive and customer audiences.

Publications or patents in FEA predictive modeling, warpage/SJR, and/or interfacial fracture testing (plus).

Experience working with external customers or partners in a technical liaison or program leadership capacity.

Excellent communication, influencing, and cross-functional collaboration skills.

Ability to manage competing priorities across multiple programs and business units.

Demonstrated ability to lead cross-functional technical programs and influence at senior levels.

Pay Range and Benefits $227,300.00 - $340,900.00. The company also offers a competitive annual discretionary bonus program and opportunities for annual RSU grants.

EEO Statement Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

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